Avi Avula has served as Methode's President and Chief Executive Officer since January 2024, when he joined the Company. Mr. Avula has over 20 years of experience in the electronics industry serving the consumer electronics, telecom, automotive, industrial, and aerospace markets and over 17 years of experience in leadership positions.
Prior to joining Methode, he served as the Vice President of Strategy for DuPont’s Electronics & Industrial (E&I) business. In that role, Mr. Avula led the strategy, growth, new business development and global commercial excellence group for E&I, which reported approximately $6 billion in 2022 revenue. He previously led the Interconnect Solutions (ICS) line of business within E&I, including the integration of DuPont Circuit and Packaging Materials and Dow Interconnect Technologies, and also led the acquisition of Laird Performance Materials. Under his leadership at ICS, revenue tripled to $1.8 billion. Previously in DuPont, he served as the Global Business Director for Displays, where he led the OLED and flexible display business. His roles at DuPont were situated both domestically and internationally.
Prior to DuPont, Mr. Avula held numerous roles with Applied Materials, most recently in Singapore where he led their business and technology development for advanced packaging. His earlier roles at Applied Materials’ headquarters in Silicon Valley included serving as Assistant to the Chairman and CEO on strategic, operational and governance matters. Mr. Avula’s additional experience includes serving as a management consultant at Booz & Co. where he worked on business, operations and product strategies across the automotive, pharmaceuticals and consumer products sectors in the U.S. and Europe.
Mr. Avula has an MBA from the University of Chicago Booth School of Business, and an MS in Industrial Engineering from Texas A&M University. He earned his bachelor’s degree in mechanical engineering from Osmania University in India. Mr. Avula was recognized by the Taiwan Printed Circuit Association in 2022 with the International Outstanding Contribution Award for his contributions to the acceleration of the development of the PCB industry in Taiwan. He is also listed as a co-inventor on two engineering patents.